Skip to main content
Infineon Powers Chinese EVs with BMS Tech, UBTECH Eyes Robotics Boom

Infineon Powers Chinese EVs with BMS Tech, UBTECH Eyes Robotics Boom

4 min read

Infineon launches PSOC™ 4 HVPA-SPM 1.0 microcontroller and HYPERRAM™ for advanced EV BMS and edge AI, partnering with Munich Electrification and AMD to boost safety and efficiency in Chinese EVs. Meanwhile, UBTECH acquires 43% of Fenglong Shares for 1.665 billion yuan, merging robotics with precision manufacturing to accelerate humanoid robot production with EV factory potential. These strides highlight China's tech edge in sustainable mobility and automation.

On December 17-24, 2024, Infineon Technologies unveiled game-changing semiconductor solutions for electric vehicles (EVs), partnering with Munich Electrification for advanced battery management systems (BMS), while UBTECH Robotics made headlines with a 1.665 billion yuan acquisition of precision manufacturer Fenglong Shares. These developments signal accelerating innovation in China's EV ecosystem and its convergence with robotics, potentially reshaping automotive supply chains and software-defined vehicles (SDVs). As Chinese EV giants like BYD and NIO push boundaries, such tech advancements promise enhanced safety, efficiency, and scalability.

Infineon's PSOC™ 4 HVPA-SPM 1.0: Revolutionizing EV Battery Management

Infineon's PSOC™ 4 HVPA-SPM 1.0 microcontroller targets high-voltage lithium-ion BMS in xEVs, delivering high-precision monitoring of current, voltage, and temperature. This upgrade boosts state-of-charge (SoC) and state-of-health (SoH) accuracy, complying with ASIL D (ISO 26262) safety standards for reliable operation in critical systems.

Key features include:

  • Integrated Arm® Cortex®-M0+ processor for edge AI acceleration, reducing central ECU load.
  • Regional architecture support enabling OEM customization, shorter development cycles, and faster time-to-market.
  • Collaboration with Munich Electrification for 'Smart Edge BMS Software', combining Infineon's hardware with software expertise to cut costs, complexity, and regulatory hurdles.

Infineon Automotive MCU VP Ralf Koedel called it a 'major breakthrough' for precise, intelligent, safe EVs, validated by early customer feedback. This aligns with Infineon's 'Drive Core' strategy, integrating semiconductors with ecosystem partners for SDV transitions—crucial for Chinese EV leaders adopting zonal architectures.

HYPERRAM™ Boosts Edge AI for Automotive Applications

Complementing the BMS launch, on December 18, Infineon announced successful testing of its 64MB HYPERRAM™ memory chips and controller IP on AMD's Spartan™ UltraScale+™ FPGA SCU35 kit. This provides a cost-effective, high-bandwidth storage solution for AMD MicroBlaze™ V soft-core RISC-V processors.

FeatureBenefit for EVs
High performance-density balanceEnables I/O expansion and board management in edge AI apps
Low pin count, low powerOptimizes FPGA designs for automotive embedded systems
Verified IP integrationAccelerates development for ADAS and infotainment

AMD's Evan Leal highlighted the balance of performance and efficiency, positioning this for Chinese EV makers integrating AI-driven features like autonomous driving.

UBTECH's Strategic Acquisition: Bridging EVs and Humanoid Robotics

Shifting to robotics with EV implications, UBTECH (9880.HK), Hong Kong's 'humanoid robot first stock', announced on December 24 a 1.665 billion yuan deal for 43% of A-share listed Fenglong Shares (002931.SZ) via protocol transfer and tender offer. Fenglong resumed trading December 25 with a one-word limit-up, hitting 21.65 yuan/share and a 4.73 billion yuan market cap.

Acquisition Breakdown:

  • Step 1: 29.99% (65.53 million shares) from controlling shareholder at 17.72 yuan/share (11.61 billion yuan).
  • Step 2: 13.02% tender offer at same price, with lock-in commitments for control.
  • Performance pledges: Fenglong commits to min. net profits of 10M yuan (2026), 15M (2027), 20M (2028).

Fenglong's expertise in precision manufacturing—serving Stihl, Husqvarna, Caterpillar, and EV firm Leapmotor—fills UBTECH's mass-production gaps. With UBTECH's Walker S2 humanoid robots at 300+ monthly capacity (aiming 10,000 in 2026) and 1.4 billion yuan in orders, this synergy targets industrial automation, potentially extending to EV factory robotics.

Why This Matters: Global Implications for Chinese EVs

These moves underscore China's dual push in EV semiconductors and robotics. Infineon's tech directly empowers BYD, NIO, XPeng, and Zeekr BMS for longer-range, safer batteries amid fierce competition. UBTECH-Fenglong integration could revolutionize EV manufacturing via humanoid labor, addressing labor shortages in gigafactories. Globally, it accelerates SDV adoption, edge AI, and sustainable mobility, with China's market (over 50% of world EV sales) leading the charge.

Competitive Edge Comparison:

Tech/CompanyKey StrengthEV Impact
Infineon PSOC™ 4ASIL D BMS precisionSafer, efficient batteries
HYPERRAM™ + AMDEdge AI storageSmarter ADAS/autonomous driving
UBTECH-FenglongPrecision manufacturingScalable robot-assisted EV production

Looking Ahead: Transforming the EV Landscape

Expect Infineon's solutions in 2025 Chinese EV models, slashing BMS costs by 20-30% via integration. UBTECH's A+H capital structure enhances funding for 10,000-unit humanoid scaling, eyeing EV assembly lines. As robotics meets EVs, watch for hybrid innovations like robot-enabled battery swapping—poised to dominate global markets.

Sources

D1EV

电动汽车

View →
D1EV

电动汽车

View →
D1EV

电动汽车

View →

Related

More Stories